Soldering agent



ratented Apr. 18, 193! UNITED STATES [PATENT om-"ice j I so1 .nsamosom Gm.lolehelress ofwilhelm deceased, Kenn-Geo.

, No I;

animalto Kilppers-lletallwu'kf mflllll'mbfl' shrines. .%No. 108.6". In Germany 8,

".4 Munich 148 287 The soft soldering of aluminum oflers considerable dimculties owing to the fact that the aluminum oxide ecverlng thesurface of the aluminum cannot, in contradistinction to most 5 other metal oxides, be removed or reduced by the known soldering agents, such as soldering grease, resin, colophony, tartaric acid, citric acid 'and so forth. For this reason attempts have hitherto been made to remove the oxide layer 1 which covers the aluminum before or during the soldering process itself by mechanical rubbing .or chemical solution. Various agents have already been disclosed for the dissolution, the activity of the same as oxide-dissolving agents 15 being based on the use of inorganicmetal chloridess For example the chlorides of zinc and calcium 'as well as of magnesium are used. These corrosive agents however suffer from the drawback that the temperature at which the oxide-dissolvingaction sets in lies too high. The corrosive agent only acts when the solder has already been fus'ed for a long time. Furthermore,

by means of these corrosive agents soldered Joints cannot be produeed which-are raistant to corrosion, since the original constituents of theage'nt which remain behind when hydrochloric acid is split oil. from the corrosive agent also have a particularly disadvantageous influence .on the.

durability of the soldering. These are readily occluded by the fused solder, and give rise to the 35 formation of pores and pipesin the soldered Joint,

and, as. aresult 'of' electrochemical processes between the soldered-Joint and the aluminum, lead in a very short time to thenestruction of the union: 'It is apparent from all the foreto going thatdurable satisfactoryisolderings canno be made with suchsoldering agents.

Ammonium chloride, which has also been pro posed for this purpose, shows a satisfactory corroding power and does mot possess the disad- 45= vantage of leaving residues at the soldered place;

, nevertheless it cannot be used for the soldering of aluminum for it'has no melting point, but immedi'ately-vaporises in the heat of the soldering operation and then sublimes. For this reason so it cannot form' 'a so-called fluxing agent, that is to say cannot bring about the flow of-the fused soldegmetal over the whole soldering place in the cracks. between the metal articles to be i joined. The thing to do would be to equalise out u this property of chloride by" addition ofanuxing'agent,ashasah'eadybeenproposedinthecaseoftheusualsoldu'ingagents. But here again success was not obtained ammonium chloride. as a consequence of its immediate volatilisation, is not in a, pddtioifto cor- 5 rode with suiilcient certainty the-whole of the slu'facetobesoldered. 1

Theotherp v. heretofore proposed, which all set out from the idea of preliminarily preparing thealuminum surfaces to be-ioined for the reception of the solder by'means ofa sep arate operation prio to the'soldering operation proper, have found acceptance, on the v one hand because of the extra work entailed, and 1 on the other hand no certain success is guaran- 1g teed because the short time elapsing between the preliminary preparation of the place to be soldered and the supplyof the soldering metal frequently suilices for oxide skins to form again.

The object of the present invention is to avoid go the. above mentioned drawbacks attending the soldering -of aluminum and to render possible the rapid production of soldered placesand Joints in which corrosion cannot be already brought aboutright from the start by occluded residues of ilu xing agent.

The inventionsets out from the knowledge that ammonium chloride itself possesses a series of properties which are necessary in the-soldering of aluminum since its baseNHs completely o disappears in the heat of the soldering operation. The corroding agent in the case of ammonium chloride is undoubtedly the hydrochloric acid, that is to say the hydrogen halide acid.

Extensive experiments have now shown that on substituting the ammonia hydrogen atoms of ammonium chloride by' means of aliphatic alkyl groups (methyl residues, ethyl residues and so forth) organic derivatives of ammoniumchloride .are obtained which have a clearly defined melting point. Abovethis melting point there is a temperature limit at which these organic an monium chloride derivatives decompose into the free base and free acid; At this moment the acid corrodes the aluminum surface and the ex? 5 'cess 'vaporising' acid immediately combines with the organic base again above the soldering place and as a result becomes harmless.

It has already been proposed to use organic bases or derivativesthereof for ordinary soldera ing purposes. In-this general form, however, the known proposal cannot in any case'be used for aluminum soldering as will be' seenfrom the following: Owing to the dimculty in attacking aluminum 'ss oxide the-corroding agent must contain hydrogen.

halide acids. Of the other mineral acids sulphuric acids does not come into consideration since it'withdraws water, that is to say chars, the organic base. The resulting carbon, or brown slimy residue, prevents the flow of the soldering metal or even access of the hydrogen halide acid to the aluminum surface. Nitric acid acts similarly; it completely burns the organic base. Other acids have the disadvantage of melting and boiling points which are too high, and of leaving behind oxidic solid residues which prevent the ilowof the solder (as for example is the case with phosphoric acid).

From this it will be seen that of the organic compounds only those of the hydrogen halide acids come into consideration.

Furthermore the choice of the organic-base also is not to be regarded as immaterial. The reason for this probably lies in the high heat conductivity of aluminum, which prevents the soldering agent always being maintained with certainty at a sufiicient temperature. Bases which are rich in carbon and nitrogen leave behind a brown smeary residue at the soldering place for example, which prevents a satisfactory soldering operation. The oxygen-rich compounds likewise lead to the formation of such residues or else possess other drawbacks.

According to the invention the consequence is reached from all this that the halogen salts of hydrogen-rich amine bases and derivatives thereof are useful soldering agents for aluminum. By hydrogen-rich compounds are to be understood those which possess a very high hydrogen content in relation to the carbon content of the molecule. The comparison between the richness in carbon and the richness in hydrogen is not based on the percentage content but on the number of carbon and hydrogen atoms present in the molecule.

These compounds and their derivatives, in addition to their outstanding corroding power, also have the advantage that they are very pronounced fluxing agents to which falls the task, so important in the case of the soldering of aluminum, of promoting the immediate flow oi the solder on the corrodedplaces.

To the hydrogen-rich halogen salts of amine bases and their derivatives which possess the above mentioned properties, belong the compounds of all amine bases of the aliphatic series, of the hydrogenated, carbocyclic and heterocyclic series, as well as the compounds of those car,- bocyclic aminebases the carbon richness of which by aliphatic substitution in the nucleus or m the base nitrogen has been compensated for by the hydrogen atoms introduced.

The following may be mentioned as examples of the soldering agent provided by the invention: 1. Methylaminehydrochlorlde.

2. Dimethylamine hydrochloride. i

3. Triethylamine hydrochloride or hydrofluo ride or hydrobromide.

4. Ethylamine hydrochloride. 5. Diethylamine hydrobrmnide.

6. Triethylamine hydrochloride. 7. Propylaminehydrochloride. 8. Butylamine hydrochloride. 9. Ethylmethylamine lwdmchloride. 10. Diethylmethylamine hydrochloride. 11. ,Diethylpropylamine g 12. Dipropyl'meth'ylamine hydrochloride. 13. Methylanili ne hydrochloride.

14. Dimethylaniline hydrochloride.

of the several halogens the chlorides are the cheapest, and the fluorides have the property of promoting flow to high degree, whilst many bromides are unsuitable on account of their hygroscopic properties. The iodides are usually too expensive.

All the disadvantage of the inorganic soldering agents heretofore used in the soldering of aluminum disappear with the new agents. Owing to the very low temperature atwhich these compounds decompose and act both corrosivelyas well as to promote the flow, the soldering placerequires to be heated only a little above the melting point of the solder, and in fact to about 275 C. Corrosions arise only to the unavoidable extent such as is brought about by the potential difference between the soldering metal and the aluminum in the presence of moisture. The corroding agent itself, however, does not lead to any corrosion. The reason for this interesting property probably lies in the fact that a part of the halogen acid is split of! at the low soldering temperature and the aluminum can corrode for the soldering, whilst the excess of vaporising hydrochloric acid forthwith unites again in the air with the likewise vaporising base to form a neutral salt. Corrosions due to the occlusion of residual decomposition substances are ,not possible since no residues form. such as is the case with inorganic soldering agents, but on the contrary the base constituents vaporise completely.

The amine bases referred to, as well as their derivatives, may be used in the most different forms in the soldering or aluminum, namely as the substance itself, the solder being strewed on, as a dry or moist, powdery or pasty mixture with granules or dust of soldering metal in combination with the latter in the form or soldering pellets, as well as in the form of the known hollow wires of soldering metal which contain the corroding and fluxing agent in their interior. The soldering proceeds particularly well with the agent when the latter is employed in the form of 'a metal paste, for the iollowingadvantages are ing of the soldering-metal so that a more unitorm smooth soldered joint can form. The reducing action maintained in the literature has no prac- Asanexampleoftheinventionapastymixmre .ormemdustotanauoyouoat unmet zincand 10% cadmium, or 60% tin and 40% zinc, orpure tin, with 22% o! the oorrodlng agent, for example trimethylamine hydrochloride; and 6 to 8% 01 petroleum jelly as plastiiying agent-has proved very suitable.

-.It has, however, ioumhthat when using a corrosive agent according to the invention in combination with a soldering metal, for in.stanoe the soldering metal first mentioned in the above example, the pasty mixtm'e is, not'durablabut,

tends to decompose which causes firstof all a deterioration of the otherwise good soldering properties and finally results in a complete'uselessness of the, pasty mixture. I

Extensive researchescarrled out to find the cause of these phenomena led to the following knowledge: If the t'riethylamine hydrochloride is used as the halogen acid salt of the hydrogen- 1 is, by

rich organic amine base then the chlorine the atmospheric moisture already, ionically split oif to about the following formula:

This chlorine in the form of ion chloride com bines with the zinc of the soldering dust to zinc ,chloride. "Zinc chloride 'is highly hygroscopic and therefore withdraws still more waten which. due to its hydrolytic action, forms new hydrochloric acid from the: basic-hydrochlorid present in the nasty mixture. This hydrochloric acid again attacks the zinc alloy. As soon as a very small amount of zinc chloride has once been 25 ing agent to the paste formed of the corrosive formed, the detenioration process must proceed with increasing speed. -It has been mentioned above toadd a plastii'y agent and the soldering metaL, {If this plastifyingagent consists of Vaseline, parai'lin oil, Vaseline oil, oil of turpentine or similar non-hygroscopic substances. then the metal dust is covered by this substance with a kind of protecting envelope and the decomposition cannot take place I so easily. With the use of pure tin as solderingness of the soldering agent.

metal also the phenomena mentioned did not show in a manner leading to a complete useless- Now, it is highly desirable to render the usefulness of. the soldering paste independent on a safe seal: against the atmospheric moisture and the quality of the plastifying agent respectively. According to a further improvement of the novel soldering paste the above explained decomposition of the substances present in the soldering paste may be obviated. This is effected by such a combination of the hydrogen-rich organic amine bases with the halogen acid salt to adouble salt or'a complex combination, that the halogen is combination'in this manner.

this problem was rendered possible in the'man er indicated above; 1. e. by the use of a halogen add salt of a hydrogen-rich organic amine .or its 'derivates as a corrosive agent. as found on searching a' base capable of the bindingof the halogen'within the-complex v combination according to the invention. This metal itself seems to be already useful, because in metallic form it constitutes the solder proper,

and because during soldering it can relatively easlly be reduced ifitis used'in the form of a combination. The well known reaction Jolders make of this property of the tin. 1

Of the-tin compounds tin tetrachloride (SnCh) has the property to easily combine with other capable of being crystallized out.

or written otherwise: I

The solution of compounds to double salts or complex combinations. Inparticular, tin easily combines with ammonium chloride,- and forms with the organic derivatives of the letter, i. e. with the amine base lwdrochloride, well defined complexes chloride with trimethylamine hydrochloride forms a'complex combination of the formula: Suck 2(CH3): NHCI ucmnfinn such This compound, chlorostannic trimethylamine, is a white non-hygroscopic salt which in aqueous solution decomposes in the ions 2mm) 3NH1+ and SnCls- 7 As may be seen from the formula, the ionic split does not result in the formation of the ion chlorine, but in the formation of the ion SiiCls.

Stannic tetra- This ion is inactive as far as the metal dust in asoldering paste for the soft soldering of aluminum comes into consideration. Soldering pa tes for the soft soldering of aluminum madeawarding to the invention have proved to be durable for a long period of time in a moistatmosphere even if the metal dust contained'a high percentage of zinc. In case of ametal dust of pure tin no decomposition whatever could be ascertained.

If according to the invention a tin containing complex combination is used, then the corrosive agent itself acts already as,reaction solder, i. e. the tin liberated during carrying out the soldering process effects the soldering.

In many cases the amount of tin liberated may alone be sufllcient for effecting the soldering; To warrant an easier handling and a .greater .safety of the action it is, however, to

be recommendedto addsome additional soldering metal in one of the known forms, preferably in the form of a paste, to the soldering agent. i For the manufacture of the complex combi-. nation substantially all the hydrogen-rich organic amine bases mentioned above or their derivatives are suitable as long as. they still show a perceptible liquid phase in theirform as double salt. Some of these bases appear to lose this .phase in the form'oo'i' a complex combination.

For instance, mono methylan ine'hydrochloride in combination with stannic chloride, when heated, directLv passes over from the solid state to the gaseous-state, so that it cann'otcome to action at' the soldering Junction and, therefore.-

is not adapted for the manufacture of a solder .ing agent according to the invention.

What I claim is:

1. A soldering composition for the soft solder ing of aluminum comprising a complex compound containing tin and a halide of a hydrogen-rich" amine base, said complex compound being adapted to split oi the halogen as tin halide during the 'soldering procedure.

\2. A soldering composition according to claim the-tin being present as-tin chloride.

I 3'. A soldering composition according to claim 1, the hydrogen-rich amine base being selected from the group composed of methylamine .hy-

drochloride, dimethylamine hydrochloride, trimethylamine hydrochloride or hydrofluoride or hydrobromide, ethylamine' hydrochloride, di-

ethylamine hydrobromide, triethylamine hydro-- chloride, propylamine hydrochloride,- butylamine hexylamine hydrochloride and piperidine hydro-' chloride.

4. A soldering composition according to claim 1, characterized by-the addition 0! a plastifying agent.

W'ILHELM HAGEMANN. 

